8kW transfer molded modules for industrial motor drives
On semiconductor has developed rugged, transfer-molded power modules to simplify compact motor drive design

On Semiconductor has developed integrated, converter-inverter-power factor correction (PFC) modules for use in industrial motor drives, servo drives and HVAC using a transfer-molding process.

The transfer−molded power integrated modules (TMPIM) are based upon standard aluminium oxide (AI2O3) substrate and an enhanced low thermal resistance substrate and contain a converter−inverter−PFC circuit consisting of single-phase converter with four 75 A, 1600 V rectifiers.

The NXH50M65L4C2SG 3-phase inverter uses six 50 A, 600 V IGBTs with inverse diodes and the NXH50M65L4C2ESG dual−channel interleaved PFC comprises two 75 A, 650 V PFC IGBTs with inverse diodes and two 50 A, 650 V PFC diodes. An NTC thermistor is embedded to allow for monitoring of device temperature during operation.

As the module is pre-assembled in an optimized layout and configuration, parasitic elements are very small when compared with discrete PCB-based designs, thereby allowing a wide PFC switching frequency range between 18 kHz and 65 kHz. The modules are rated at 50 A permitting use in applications up to 8 kW, and are the latest devices in the On Semiconductor TMPIM family. Other devices are available with current ratings of 20 A and 30 A.

The transfer-molded DIP-26 package measures 73 mm x 47 mm x 8 mm, 20 percent smaller than the current press fit modules. The sealed and robust package includes an integrated heatsink (with 6 mm clearance to pins) and offers high levels of corrosion resistance. A silicon carbide (SiC) option is also available for further increased switching frequency and efficiency.

The NXH50M65L4C2SG and NXH50M65L4C2ESG TMPIM modules work alongside the FAN9672 PFC controller and gate driver solutions including devices in the new NCD5700x family. The NCD57252 dual channel isolated IGBT/MOSFET gate driver offers 5 kV of galvanic isolation and can be configured for dual low-side, dual high-side or half-bridge operation. The NCD57252 is housed in a small SOIC-16 wide body package and accepts logic level inputs (3.3 V, 5 V & 15 V). The high current device (source 4.0 A / sink 6.0 A at Miller plateau voltage) is suitable for high-speed operation as typical propagation delays are 60 ns.

Using a TMPIM with a standard pinout that minimizes parasitic to give designers a high performance ‘plug and play’ solution. Coupling the NXH50M65L4C2SG and NXH50M65L4C2ESG with FAN9672 and NCD57252 provides a rapid design path to more efficient motor control solutions.

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