The MG12600WB-BR2MM Series gives designers a substantially higher current rating than the portfolio’s previous maximum current rating (450A), offering the high efficiency and fast switching speeds of IGBT technology in a robust and flexible format. The module’s 152 x 62 x 17 mm package simplifies thermal management and allows for less complex, more elegant system designs. The multi-chip module reduces solder joint and PC board space requirements and the configuration package is available in various current ratings for the release of products across a wide power range.
“This 1200V, 600A module extends the current range in our industry-standard module package so customers may use the same thermal and PC board design to release multiple power ratings within their platforms,” said Dr Kevin Speer, global manager of technology strategy for Power Semiconductors at Littelfuse. “The semiconductor technology allows high conversion efficiencies, while the multi-chip module enables elegant system design with fewer failure points for greater reliability.”
The MG12600WB-BR2MM uses trench-gate field stop IGBT technology to ensure optimal conduction and switching performance, and the low saturation voltage and positive temperature coefficient means that the modules can be easily paralleled to increase system current. Fast switching and short tail current allows for higher system efficiency through reduced switching losses
The MG12600WB-BR2MM 1200V, 600A Half-Bridge IGBT Module Series is provided in bulk with a minimum order quantity of 60.