Infineon opens 300mm power fab in Villach
Infineon‘s latest power fab opens today in Villach, Austria, with 60,000 m² of floor space for fully automated production of silicon IGBTs and MOSFETs on thin 300mm wafers

“The new fab is a milestone for Infineon, and its opening is very good news for our customers,” said Reinhard Ploss, CEO of Infineon, opening of the company’s latest power semiconductor plant in villach, Austria, with an app rather than a pair of scissors to cut a ribbon.

“The timing to create new capacity in Europe could not be better, given the growing global demand for power semiconductors. The last few months have clearly shown how essential microelectronics are in virtually every area of life. Given the accelerated pace of digitalization and electrification, we expect demand for power semiconductors to continue to grow in the coming years. The additional capacities will help us serve our customers worldwide even better, including long term,” he said.

After three years of preparation and construction, the factory was commissioned at the beginning of August, three months ahead of schedule. The first wafers will leave the Villach plant this week. In the first stage of expansion, the chips will primarily be used to meet demand from the automotive industry, data centres and renewable energy generation of solar and wind power. The plant will give Infineon additional sales potential of around two billion euros per year.

The new chip factory has about 60,000 m² of gross floor space and production will be gradually ramped up over the next four to five years. More than two-thirds of the 400 additional highly qualified specialist jobs needed to operate the fully-automated fab have already been hired.