The 600V STK57FU394AG-E (15A) and STK5MFU3C1A-E (30A) modules integrate a power factor correction (PFC) converter, three-phase inverter output stage, pre-drive circuitry and protection in a single, compact package. High levels of integration help to reduce part count and board space compared to discrete designs in applications that include motor control, inverter control and HVAC systems. Microcontroller-compatible low-voltage input and status outputs support further component and space reduction by eliminating the need for photocouplers between a host micro and the IPM.
The devices feature built-in cross conduction prevention, which reduces the possibility of system malfunctions caused by noise, and over-current protection for both the inverter and PFC section. Under-voltage lock-out ensures IGBT gate shutdown in the event of abnormal conditions. The devices are certified to UL1557 and offer an externally accessible embedded thermistor for high-precision monitoring of the temperature of the insulated metal substrate.
“Our advanced packaging and integration capabilities deliver high-performance, efficient and compact power devices that address industry requirements to reduce BoMs and drive PCB real estate requirements. The STK57FU394AG-E and STK5MFU3C1A-E deliver the power density, functionality and reliability demanded by next-generation inverter-based systems,” said Sungil Yong, director of IPMs for the high power division at ON semiconductor.
The STK57FU394AG-E is offered in a 56 mm x 25.8 mm SIP2A package and priced at $7.40 per unit in 10,000 unit quantities. The STK5MFU3C1A-E is offered in a 70 mm x 30.1 mm SIP3B package and priced at $12.30 per unit in 10,000 unit quantities. The new IPMs are available today and two evaluation boards can also be ordered, the STK57FU394AGGEVB and STK5MFU3C1AGEVB, which are recommended for designers who want to evaluate the devices in detail.