Lineup expansion of Schottky barrier diodes with 60 V products using the compact US2H package that has excellent heat dissipation allowing easier thermal design : CUHS15F60, CUHS20F60, CUHS15S60, CUHS20S60
Product News 2021-01
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched four 60 V Schottky barrier diode (SBD) products -"CUHS15F60," "CUHS20F60," "CUHS15S60," and "CUHS20S60"- which are suitable for rectification purpose of power supply lines with demands for raising voltage to expand the lineup.
CUHS15F60 and CUHS20F60 are low forward voltage products placing importance on the balance between the forward voltage and reverse current, while CUHS15S60 and CUHS20S60 are ultra-low forward voltage products placing importance on reducing the forward voltage. The average rectified current of CUHS15F60 and CUHS15S60 is 1.5 A, and that of CUHS20F60 and CUHS20S60 is 2 A. The average rectified current of 60 V products using the US2H package has been 1 A only so far, but now 1.5 A and 2.0 A products are newly available in the lineup.
Industrial equipment such as servers and network equipment are being required to become smaller and less power consuming. Power lines have been using 12 V or 24 V, but a higher voltage of 48 V is being considered for reducing power consumption. The new products are 60 V products that can be used for 48 V power supply lines, helping reduce the size and power consumption of industrial equipment.
The new CUHS20F60 low forward voltage product features a forward voltage (typ.) of 0.41 V, about 27 % reduction from the existing CUHS10F60, and the new CUHS20S60, an ultra-low forward voltage product, features a forward voltage (typ.) of 0.35 V. Reduction of the forward voltage helps improve the efficiency of power supplies.
SBDs used for rectified current need to be selected depending on the circuit conditions where they are used, since the required performance varies depending on the output voltage, output current and operating frequencies. With the expanded lineup, products suitable for various circuits are provided.
The products use the US2H package (Package code : SOD-323HE) which is small (2.5 mm×1.4 mm×0.6 mm (typ.)) and features a low thermal resistance to meet the market demand for smaller and thinner devices.
 @IF=1.0 A
 Rth(j-a)=105 °C/W @Mounted on an FR4 board (25.4 mm×25.4 mm×1.6 mm, Cu Pad : 645 mm2)
- Low forward voltage :
Case of CUHS20F60
VF=0.41 V (typ.) @IF=1.0 A
VF=0.52 V (typ.) @IF=2.0 A
- Low reverse current :
Case of CUHS20F60
IR=70 μA (max) @VR=60 V
- Small compact surface mount package :
High-density mounting secured with US2H package (Package code : SOD-323HE)
- Industrial equipment
Server and network equipment for power supply (Rectification and backflow prevention, etc.)
Application Circuit Examples
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass-production design stage. Providing these application circuit examples does not grant any license for industrial property rights.
The new products CUHS20S60 and CUHS20F60 have reduced their VF compared with the existing product CUHS10F60, helping to improve efficiency on conductive state.
 As of October 2020, values measured by Toshiba.
Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.