Mini dual-inline-package intelligent power modules target industrial applications
Mitsubishi Electric has announced a new series of transfer-mold-type, mini dual-inline-package intelligent power modules (DIPIPM) primarily for inverter drive systems of small-capacity motors, servos and other industrial equipment.

The modules feature embedded bootstrap diode (BSD) chips, embedded analog temperature voltage output (VOT) and a 5 to 50A current rating. The Mini DIPIPM series uses sixth-generation IGBT chips featuring the carrier-stored trench-gate bipolar Transistor (CSTBT) structure, a special feature of Mitsubishi Electric IGBT chips, as well as integrated external components such as BSD, current-limiting resistors and thermistors, to reduce the power consumption, size and cost of small-capacity inverter systems. The 31.0×52.5×5.6mm unit reduces losses a further 10% compared to Mitsubishi Electric’s existing DIPIPM Ver.3 series. The Mini DIPIPM Series is compliant with the European RoHS.