Module-level thermal management: LEDs and power electronics learn from each other
In 2015, all economic indicators pointed to continued market growth for both industries, power electronics and LEDs, especially with IGBT modules boosted by EV/HEV industry and general lighting applications, a killer application for LEDs since 2012, observes market research firm Yole Développement.

To support this growth and answer the thermal management needs in power electronics and LED, lot of innovative technologies are emerging. According to Yole, one of the most impressive technical developments is the convergence of thermal management for both sectors, LED and power electronics, particularly the materials used for thermal management.

Thepowered by Yole’s Power Electronics & LED teams, reviews insight into synergies between power electronics and LED for thermal management.

It describes and analyzes drivers and challenges that are facing industrial companies. This latest report proposes an overview of the market trends and technology evolution including 2015-2021 market figures, technology status and technical roadmap analysis and more. Under this report, Yole’s analysts also offer business model and supply chain analysis across various materials used for thermal management.
A rapid convergence of key technologies is driving unprecedented change. In this dynamic environment, Yole’s goal is to understand their customers’ strengths and guide their success.

“Power electronics and LEDs are different industries that today face similar challenges”, explains Dr Pierric Gueguen, Business Unit Manager at Yole. ”Needs for green energy with lower CO2 emissions have led these industries to develop more efficient and smaller solutions.”

At the device level, cost pressure and the need for better performance is pushing designers towards smaller and thinner chips, also leading to increased power density. Such power density targets in both power electronics and LEDs bring a convergence of thermal management requirements, supporting the development of new materials.

Among materials used for thermal management, Yole specifically investigated the market and technology evolution of die attach, substrates, baseplates/PCBs and encapsulants. Overall, the market for these materials was worth US$1.98 billion in 2015 and will grow to US$3.16 billion by 2021 at a CAGR of 6%.
“Their value proposition has the potential to bring business to their suppliers and key differentiating factors to device manufacturers”, comments Pierrick Boulay, Technology & Market Analyst at Yole.