New IGBT module family targets renewable systems and industrial drives
Infineon Technologies is presenting the EconoPACK + D family, the latest generation of power semiconductor modules in the 1200 V and 1700 V voltage classes with up to 450 A nominal current, at the PCIM Europe 2011 (May 17-19) in Nuremberg, Germany.

Infineon has developed the new EconoPACK + D series based on the well-known and established EconoPACK+ platform to master the ever-growing demands in applications such as renewable energies, commercial vehicles, elevators, industrial drives or power supplies. Thanks to numerous improvements and innovations, such as ultrasonic welded power terminals, an optimized base plate structure or reliable and innovative PressFIT control pin technology, the new modules open the door to implementing rugged and efficient power converter concepts on a small footprint.      

Longer service life, higher power density and a robust module package permitting the use of future chip generations – these are the major challenges faced in developing new power modules. Examples of new fields of application posing challenging electrical and mechanical demands are electric or hybrid drives in commercial vehicles such as city buses and vans. The vehicles and the assemblies used – including the power modules – have to withstand both high electric stress and heavy mechanical loads such as shock and vibration, as well as frequent temperature change during operation.      

Modules with current ratings of 225 A through 450 A, with 1200 V and 1700 V voltage ratings, open the door to developing efficient and compact inverters. Featuring screw power terminals providing excellent electric connection and PressFIT control pins for solderless inverter assembly, the EconoPACK + D modules are ideal for an array of industrial applications. The ultrasonic welded power terminals increase the mechanical robustness and permit higher currents. Furthermore, the modules deliver reduced conduction losses, optimized stray inductance and – thanks to the latest chip technologies, IGBT4 – a higher operation junction temperature of maximum 150°C and hence a higher I RMS current. Combined with the high IGBT4 power cycling capability, Infineon’s power modules raise the bar.