Microsemi Corporation has introduced three families of power modules spanning all major solar converter topologies. The new products include boost-only modules for solar converters with and without transformers, and a family of boost-and-buck modules for three-phase, three-level neutral point clamped (NPC) solar converters.

Microsemi has released nine modules for transformer-based converters, including solutions for the transformer’s primary side that combine power factor correction (PFC), bypass diode and phase leg functionality, and solutions for the transformer’s secondary side that combine a secondary fast rectifier with a full bridge.

The company also has introduced four modules for transformerless solar converters that combine a boost stage with bypass diode and fast full bridge, as well as three modules for three-phase, three-level NPC solar converters that include boost and buck stages to provide an interface between solar panels and the converter’s output stage.      

Microsemi offers customers a variety of mix-and-match feature options for modules that are tailored for use in the following applications:      

Transformer-based Solar Converters: For applications on the transformer’s primary side, customers have a choice of diodes for the modules’ MOSFET boost stage, and can select either standard MOSFETs or  those with an improved body diode in the phase leg, which is targeted for use in a phase-shifted or zero voltage switching (ZVS) topology. All devices are housed in a low-profile, low-inductance SP1 package. For the secondary side, Microsemi offers modules in an SP3F package that include a thermal sensor for over-temperature protection plus an IGBT/MOSFET combination for the output bridge. Alternatively, customers can choose an all-IGBT option (trench and field stop) to minimize conduction losses at line frequency, or an all-MOSFET option to maximize bridge efficiency.     

Transformerless Solar Converters:  Microsemi’s new modules combine PFC, bypass diode and full bridge functionality along with a thermal sensor in an SP3F package. For the output bridge, customers can choose an  IGBT/MOSFET combination, or specify an all-MOSFET configuration or one that combines trench and Non-Punch-Through (NPT) IGBT switch technology.  A choice of CoolMOS or SiC diodes is available for implementing the  modules’ bypass functionality.