Automotive qualification means that the modules provide significantly increased thermal cycling and thermal shock capability, while a new soft diode improves the EMI behavior. “Extending our proven EconoDUAL 3 family by fully automotive qualified products, Infineon takes advantage of its experience both in developing and producing IGBT modules as well as handling and fulfilling specific automotive requirements,” says Zhang Xi, Manager Technical and Product Marketing at Infineon Technologies.
The optimized design and assembly technology of the new automotive qualified EconoDUAL 3 modules enables a more than three times higher thermal cycling capability, while the thermal shock capability is increased by a factor of ten compared to the industry standard. The new modules also feature PressFit pins which means that they can be installed without soldering.
The modules of the EconoDUAL 3 series offer the highest power density (up to 600A/1200V) available within this module footprint. The modules provide superior switching performance while copper wire bonding leads to a reduced internal lead resistance. With the use of copper bonding technology as well as an improved DCB the output power can be increased by up to 30% when compared to the related 450A version.
Samples of the automotive qualified EconoDUAL 3 modules FF400R12ME4A_B11 (400A, 1200V) and FF600R12ME4A_B11 (600A, 1200V) will be available in Q4 2013, with volume production planned in the second half of 2014.