Semikron gears up for sales growth
Semikron is celebrating the company’s 60th anniversary by expanding its headquarters in Nuremberg, Germany. The company has opened a 12,300 m² state-of-the-art logistics centre which has been added to the HQ’s total area of 42,000 m². The new development will help Semikron gear up for future growth.

During 2010 and 2011, a total of €114 million has been invested in the expansion of production areas and equipment worldwide.

Marking its 60th anniversary, Semikron has announced a turnover of €545 million for the business year 2010 – an increase of 68% compared to 2009. Since the first diode/thyristor module was developed and presented to the market in 1975, Semikron claims to be the market leader in this sector.

Approximately 31% of Semikron’s turnover is generated from the renewable energies market, which has more than doubled over the last three years, following the drives market with a share of 35%. Semikron developed the first IGBT modules for use in wind turbines the beginning of the 1990s. The modules featured innovative pressure contact technology, integrated power, driver and sensor functions and met the challenges posed by this new area of application in terms of long-term reliability and power density.

The company’s experience in the electric hybrid vehicle market also dates back to the early 1990s, long before the German government announced that one million passenger cars must be electrically driven by 2020. In 2010 Semikron introduced Skai, the most compact power Electronic systems for hybrid and electric vehicles for use in the agricultural industry, construction industry, materials handling and battery-powered vehicles of any kind. The dedication to this market is evident in partner co-operations with Compact Dynamics and Drivetek and the 100% take-over of Vepoint. 560,000 electric fork-lift trucks and 8,250 hybrid buses are powered by Semikron technology.

In May 2011, Semikron launched a revolutionary packaging technology for power semiconductors, which does not use bond wires, solders or thermal paste. The reliable and space-saving technology is the optimum solution for vehicle and wind-power applications – markets with a high growth rate.